Special Session 1
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SmartCards and Contactless Communication Technologies – improving interoperability and expanding functionality
- Michael Gebhart, NXP Semiconductors
- Michael Stark, NXP Semiconductors
Intention:
This Special Session is intended as a chance for engineers mainly of local industry (which has a focus on the topic) to meet and discuss their field of work, and to get in touch with TUG.
Summary:
In contrast to conventional wireless communication, which can be used to bridge "the last mile" gap, contactless communication technologies are used to bridge a few centimeters up to a few meters. The application range covers logistics, access control, public transport tickets, e-government (like the e-Passport, e-ID Cards, health cards, driving licenses), e-commerce (like contactless credit cards), NFC, secure device (SD) memory cards, remote sensing and control (Radio Frequency Activation, RFA). This batteryless, contactless technology belongs to short-range devices and operates in harmonized, license-free ISM frequency bands in LF (125 / 131 kHz), HF (13.56 MHz) and UHF (840 - 960 MHz) in the near field. It is essential to understand that challenges for this technology are application specific and multidisciplinary.
Authors are encouraged to submit their contributions related to, but not restricted to the following topics:
- Interoperability of all RFID and Contactless SmartCard standards and the test environment for contactless characterization,
- Smart antenna design (e.g. smaller antennas, detuning compensation) and signal processing to give arbitrary objects secure SmartCard functionality
- Combination of different technologies (e.g. HF / UHF) to extend capabilities for new applications, emission & immission,
- Very High Data Rates for SmartCards,
- Emerging NFC technologies and topics related to the integration into Smartphones (antenna design, emission / immission), emerging modulation techniques,
- Integration of RFID chips on printed circuit boards for logistics applications and integration of RFID IP-blocks as part of ASIC chip design.
All submissions to special session should follow the regular submission procedure and will be subjected to peer review coordinated by the Special Session Chair(s) and TPC Chairs.
Paper format is the same as for the general conference.
The papers must be submitted through EDAS, under the respective special session track. See paper format for more details.
The deadline (for all special sessions) is extended to March 8, 2011.
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Organized by: Graz University of Technology – Faculty of Electrical and Information Engineering * University of Zagreb – Faculty of Electrical Engineering and Computing * Österreichischer Verband für Elektrotechnik (ÖVE)